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Equipment Sales Engineer
Negotiable
Job Requirements: 1. Educational Background: Bachelor’s degree or above in a relevant field such as Electronics, Mechanical Engineering, or Semiconductor Technology. 2. Work Experience: At least 3 years of experience in semiconductor packaging production processes, or in sales roles related to semiconductor equipment. 3. Skill Requirements: - Proficiency in semiconductor packaging processes and hands-on experience with equipment; understanding of the operational principles and applications of key packaging machinery. - Familiarity with the semiconductor packaging market and existing customer network. - Strong English reading and writing skills, with a solid grasp of technical terminology specific to the semiconductor industry. 4. Personal Qualities: - Strong sense of responsibility and excellent teamwork skills. - Ability to travel frequently and resilience under pressure. Job Responsibilities: 1. Technical Support: - Provide technical consultation and tailored solutions for semiconductor clients regarding packaging equipment such as wafer dicing machines and final product cutting machines. - Assist the sales team in addressing technical challenges encountered by customers during product usage. - Conduct equipment demonstrations, technical discussions, and training sessions to ensure clients can effectively utilize the products. 2. Sales Collaboration: - Support the sales team in achieving sales targets by offering technical expertise and guidance. - Participate in client process requirement assessments, providing professional recommendations to help customers select the most suitable equipment. - Monitor project progress closely, ensuring timely resolution of any technical issues to enhance customer satisfaction.
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